“Printing” the Future of the Electronics World — eSUN to Showcase at the 2025 Hong Kong Electronics Fair (Autumn Edition)
The Hong Kong Electronics Fair held in spring and autumn is recognized as one of the world’s largest and most influential electronics exhibitions. The 2025 Autumn Edition will once again focus on next-generation advanced electronics and modern lifestyle solutions.
Innovative Materials, Creative Life! eSUN will showcase a wide range of 3D printing materials at Booth 5E-C02. We sincerely invite you to visit and explore innovative 3D printing applications in the electronics industry.
Applications of 3D Printing Technology in the Electronics Industry
1.Housings and Structural Parts
Such as enclosures, brackets, fixing slots, and heat-dissipating channels. With the maturity of flame-retardant and UV-resistant modified materials, FDM printing can replace some injection-molded parts for small-batch enclosures and industrial tooling.
2.Embedded Electronics and Functional Integration
Sensors, chips, and wires can be embedded directly during printing to create integrated electronic modules.
3.Flexible and Wearable Electronics
Applications include wristbands, protective cases, shock-absorbing pads, and flexible sensor carriers for wearable devices.
4.Electronic Fixtures and Jigs
Positioning fixtures, functional testing jigs, and ESD-safe supports in electronics manufacturing.
FDM 3D printing technology is already widely used for electronic prototypes and tooling. The development of multifunctional materials such as flame-retardant, ESD-safe, high-temperature, and specialty materials will further accelerate its adoption in industrial, automotive, and aerospace electronics.
Featured 3D Printing Materials at eSUN Booth
1.ESD Materials – Protecting Sensitive Electronic Components
eSUN has developed multiple ESD-safe materials including PETG-ESD, ABS-ESD, and PC-ESD to meet diverse application needs.
2.Flame-Retardant Materials – Higher Safety Standards for Electronic Components
Materials such as ABS-FR and PET-FR meet the UL94 V-0 standard, providing flame resistance for a wide range of temperature conditions.
3.Flexible & Elastic Materials – Combining Durability and Adaptability for Wearables and Creative Applications
The demand for flexible 3D printing materials is growing rapidly. eSUN offers a full range of flexible solutions including new PEBA materials and various TPU grades suitable for wearables and innovative electronics.
4.General & Aesthetic Materials – Enhancing the Visual Creativity of Electronics
eSUN’s PLA series offers a wide range of colors and finishes for personalized designs. Transparent materials like PETG and PLA-Clear can be used for sensor windows or indicator light housings.
At this exhibition, eSUN will highlight how 3D printing accelerates innovation and upgrades in the electronics industry—covering both functional and aesthetic applications, from prototyping to production.
We warmly welcome you to visit our booth and explore how 3D printing can unlock more possibilities for the electronics industry!
Event Information
Event: 2025 Hong Kong Electronics Fair (Autumn Edition)
Date: October 13–16, 2025
Venue: Hong Kong Convention and Exhibition Centre
Booth: 5E-C02
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